US Patent 11844191 Apparatus for heat management in an electronic device

An apparatus and heat management mechanism are described. The apparatus includes an outer casing enclosing at least one heat generating electronic structure, such as a plurality of electronic components included on at least printed circuit board, the outer casing having an inner surface and an outer surface. The apparatus and the heat management mechanism further include a heat dissipation structure thermally coupled to the heat generating structure or printed circuit board, the heat dissipation structure forming an open-ended columnar channel, the open-ended columnar channel allowing air to flow within the heat dissipation structure in a direction parallel to a surface of the heat generating structure or printed circuit board.