Is a
Patent attributes
Patent Jurisdiction
Patent Number
Patent Inventor Names
Kyung Suk Oh0
Eunseok Song0
Seung-Yong Cha0
Ae-Nee Jang0
Date of Patent
December 5, 2023
0Patent Application Number
178531400
Date Filed
June 29, 2022
0Patent Citations
Patent Primary Examiner
Patent abstract
A system-in-package module includes a substrate, an application specific integrated circuit (ASIC) chip on the substrate, first wafer level package (WLP) memories on the substrate spaced apart from the ASIC chip in a first direction parallel to an upper surface of the substrate, and second WLP memories on the substrate spaced apart from the ASIC chip in a direction opposite to the first direction.
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