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US Patent 11833788 Method for producing a multi-layer substrate

OverviewStructured DataIssuesContributorsActivity
Is a
Patent
Patent
0
Date Filed
August 10, 2020
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Date of Patent
December 5, 2023
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Patent Application Number
16988812
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Patent Citations
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US Patent 8568283 Method for inserting a first folded film within a second folded film
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US Patent 8574698 Water-based hot-foam adhesive panel
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US Patent 8747603 Adhesive having insulative properties
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US Patent 9056712 Thermally activatable insulating packaging
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US Patent 9260633 Electrically conductive adhesives comprising bucky paper and an adhesive resin
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US Patent 9273230 Hot melt assist waterborne adhesives and use thereof
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US Patent 9522772 Insulating packaging
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US Patent 9580228 Thermally activatable insulating packaging
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US Patent 9580629 Adhesive having insulative properties
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US Patent 9591937 Insulating container
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•••
Patent Inventor Names
Mario Eckers
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Roland Bochnia
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Rainer Bongers
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Stefan Strenger
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Patent Jurisdiction
United States Patent and Trademark Office
United States Patent and Trademark Office
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Patent Number
11833788
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Patent Primary Examiner
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Francisco W Tschen
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CPC Code
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B32B 2439/46
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B32B 27/08
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B32B 3/06
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B32B 3/18
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B32B 5/16
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B32B 7/05
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B32B 7/12
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B32B 27/10
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B32B 27/306
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B32B 29/04
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•••

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