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US Patent 11833349 Systems and methods for treating cardiac arrhythmias

Patent 11833349 was granted and assigned to Cardiac Pacemakers, Inc. on December, 2023 by the United States Patent and Trademark Office.

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Is a
Patent
Patent
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Patent attributes

Patent Applicant
Cardiac Pacemakers, Inc.
Cardiac Pacemakers, Inc.
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Current Assignee
Cardiac Pacemakers, Inc.
Cardiac Pacemakers, Inc.
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Patent Jurisdiction
United States Patent and Trademark Office
United States Patent and Trademark Office
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Patent Number
118333490
Patent Inventor Names
Arthur J. Foster0
Brendan Early Koop0
Lili Liu0
Dana Sachs0
Benjamin J. Haasl0
Justin Robert Alt0
Date of Patent
December 5, 2023
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Patent Application Number
168305680
Date Filed
March 26, 2020
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Patent Citations
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US Patent 7212870 Dual helix active fixation stimulation lead
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US Patent 7236821 Chronically-implanted device for sensing and therapy
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US Patent 7248913 Guiding introducer system for use in medical procedures in the left ventricle
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US Patent 7295879 Double helical antenna assembly for a wireless intravascular medical device
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US Patent 7309354 Body lumen device anchor, device and assembly
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US Patent 7310556 Implantable medical stimulation apparatus with intra-conductor capacitive energy storage
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US Patent 7313444 Self-anchoring coronary sinus lead
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US Patent 7321798 Trans-septal/trans-myocardial ventricular pacing lead
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...
Patent Primary Examiner
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Gary Jackson
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CPC Code
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A61N 2001/0578
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A61N 2001/0585
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A61N 1/37518
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A61N 1/0575
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A61N 1/37205
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A61N 1/0565
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A61N 1/37512
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A61N 1/0573
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Patent abstract

A leadless pacing device may include a housing having a proximal end and a distal end, and one or more electrodes supported by the housing. The housing may include a body portion and a header. A distal extension may extend distally from the header of the housing, the distal extension including one or more electrodes. The header may include a guide wire port and a guide wire lumen may extend from the guide wire port through the header of the housing and through the distal extension. A fixation member may extend from the header of the housing. The header may be formed from an over mold process.

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