US Patent 11805342 Sound producing package structure and manufacturing method thereof
Patent 11805342 was granted and assigned to xMEMs Labs, Inc. on October, 2023 by the United States Patent and Trademark Office.
Is a
Current Assignee
Date Filed
June 16, 2021
Date of Patent
October 31, 2023
Patent Applicant
Patent Application Number
17348773
Patent Citations
Patent Inventor Names
Hsien-Ken Liao
Chiung C. Lo
Martin George Lim
Patent Jurisdiction
Patent Number
Patent Primary Examiner
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