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US Patent 11801635 Laser pulse shaping for additive manufacturing

Patent 11801635 was granted and assigned to Lawrence Livermore National Security (company) on October, 2023 by the United States Patent and Trademark Office.

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Contents

Is a
Patent
Patent

Patent attributes

Patent Applicant
‌
Lawrence Livermore National Security (company)
Current Assignee
‌
Lawrence Livermore National Security (company)
Patent Jurisdiction
United States Patent and Trademark Office
United States Patent and Trademark Office
Patent Number
11801635
Patent Inventor Names
Eric B. Duoss
Joshua D. Kuntz
Christopher Spadaccini
Andrew J. Bayramian
James A. Demuth
Date of Patent
October 31, 2023
Patent Application Number
17984786
Date Filed
November 10, 2022
Patent Citations
‌
US Patent 10220471 Spatter reduction laser scanning strategy in selective laser melting
‌
US Patent 10000023 Apparatus and method for forming three-dimensional objects using linear solidification
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US Patent 10376987 Laser pulse shaping for additive manufacturing
Patent Primary Examiner
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Dana Ross
CPC Code
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B23K 26/066
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B23K 26/144
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B23K 26/342
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B33Y 30/00
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B33Y 50/02
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B33Y 80/00
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B23K 26/0643
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B23K 26/0622
...
Patent abstract

The present disclosure relates to an apparatus for additively manufacturing a product in a layer-by-layer sequence, wherein the product is formed using powder particles deposited on an interface layer of a substrate. A laser generates first and second beam components. The second beam component has a higher power level and a shorter duration than the first beam component. A mask creates a 2D optical pattern in which only select portions of the second beam components can irradiate the powder particles. The first beam component heats the powder particles close to a melting point, where the particles experience surface tension forces relative to the interface layer. While the particles are heated, the second beam component further heats the particles and also melts the interface layer before the surface tension forces can act on and distort the particles, enabling the particles and the interface layer are able to bond together.

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