US Patent 11792912 Heat dissipation structure with stacked thermal interface materials
Patent 11792912 was granted and assigned to Wistron NeWeb Corporation on October, 2023 by the United States Patent and Trademark Office.
Is a
Current Assignee
Date Filed
February 17, 2022
Date of Patent
October 17, 2023
Patent Applicant
Patent Application Number
17673950
Patent Citations
Patent Inventor Names
Bo-Yen Chen
Patent Jurisdiction
Patent Number
Patent Primary Examiner
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