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US Patent 11791534 Antenna package for signal transmission
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Is a
Patent
Date Filed
August 3, 2021
Date of Patent
October 17, 2023
Patent Application Number
17392680
Patent Citations
US Patent 10269732 Info package with integrated antennas or inductors
US Patent 10211171 Antenna in embedded wafer-level ball-grid array package
US Patent 10756033 Wireless module with antenna package and cap package
US Patent 8759950 Radio- and electromagnetic interference through-silicon vias for stacked-die packages, and methods of making same
US Patent 9252077 Package vias for radio frequency antenna connections
Patent Inventor Names
Wen-Shiang Liao
Feng-Wei Kuo
Patent Jurisdiction
United States Patent and Trademark Office
Patent Number
11791534
Patent Primary Examiner
Karen Kusumakar
CPC Code
H01L 21/0273
H01L 21/568
H01L 21/4857
H01L 23/49838
H01L 21/6835
H01L 23/293
H01L 24/19
H01L 23/5384
H01L 21/486
H01L 23/3135
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