Log in
Sign up
Golden has been acquired by ComplyAdvantage.Read about it here ⟶
‌

US Patent 11791270 Direct bonded heterogeneous integration silicon bridge

OverviewStructured DataIssuesContributorsActivity
Is a
Patent
Patent
Date Filed
May 10, 2021
Date of Patent
October 17, 2023
Patent Application Number
17315859
Patent Citations
‌
US Patent 8064224 Microelectronic package containing silicon patches for high density interconnects, and method of manufacturing same
‌
US Patent 8227904 Multi-chip package and method of providing die-to-die interconnects in same
‌
US Patent 9330946 Method and structure of die stacking using pre-applied underfill
‌
US Patent 9357646 Package substrate
‌
US Patent 9368450 Integrated device package comprising bridge in litho-etchable layer
‌
US Patent 9373559 Low-stress dual underfill packaging
‌
US Patent 9653428 Semiconductor package and fabricating method thereof
‌
US Patent 9860996 Selective area heating for 3D chip stack
‌
US Patent 9865569 Planarity-tolerant reworkable interconnect with integrated testing
‌
US Patent 9875986 Micro-scrub process for fluxless micro-bump bonding
•••
Patent Inventor Names
Paul S. Andry
Pascale Gagnon
Vijayeshwar Das Khanna
Kamal K Sikka
Marc A. Bergendahl
Maryse Cournoyer
Hiroyuki Mori
Dale Curtis McHerron
Ravi K. Bonam
Isabel De Sousa
•••
Patent Jurisdiction
United States Patent and Trademark Office
United States Patent and Trademark Office
Patent Number
11791270
Patent Primary Examiner
‌
William A Harriston
CPC Code
‌
H01L 23/5381

Find more entities like US Patent 11791270 Direct bonded heterogeneous integration silicon bridge

Use the Golden Query Tool to find similar entities by any field in the Knowledge Graph, including industry, location, and more.
Open Query Tool
Access by API
Golden Query Tool
Golden logo
By using this site, you agree to our Terms of Service.