Log in
Sign up
Golden has been acquired by ComplyAdvantage.Read about it here ⟶
‌

US Patent 11790219 Three dimensional circuit implementing machine trained network

OverviewStructured DataIssuesContributorsActivity
Is a
Patent
Patent
Date Filed
October 13, 2021
Date of Patent
October 17, 2023
Patent Application Number
17500374
Patent Citations
‌
US Patent 9142262 Stacked semiconductor device
‌
US Patent 11011494 Layer structures for making direct metal-to-metal bonds at low temperatures in microelectronics
‌
US Patent 11011503 Direct-bonded optoelectronic interconnect for high-density integrated photonics
‌
US Patent 11031285 Diffusion barrier collar for interconnects
‌
US Patent 11037919 Techniques for processing devices
‌
US Patent 11056348 Bonding surfaces for microelectronics
‌
US Patent 11069734 Image sensor device
‌
US Patent 11176450 Three dimensional circuit implementing machine trained network
‌
US Patent 11195748 Interconnect structures and methods for forming same
‌
US Patent 11205625 Wafer-level bonding of obstructive elements
•••
Patent Inventor Names
Kenneth Duong
Steven L. Teig
Patent Jurisdiction
United States Patent and Trademark Office
United States Patent and Trademark Office
Patent Number
11790219
Patent Primary Examiner
‌
Mamadou L Diallo
CPC Code
‌
H01L 2225/06513
‌
H01L 2225/06517
‌
H01L 2225/06565
‌
H01L 2225/06586
‌
G06N 3/08
‌
G06N 3/04
‌
G06F 2201/85
‌
H03K 19/21
‌
H01L 2224/16145
‌
H01L 24/16
•••

Find more entities like US Patent 11790219 Three dimensional circuit implementing machine trained network

Use the Golden Query Tool to find similar entities by any field in the Knowledge Graph, including industry, location, and more.
Open Query Tool
Access by API
Golden Query Tool
Golden logo
By using this site, you agree to our Terms of Service.