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US Patent 11787194 Sealed interconnects
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Is a
Patent
Date Filed
July 18, 2019
Date of Patent
October 17, 2023
Patent Application Number
17294969
Patent Citations
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US Patent 9108448 Temperature control circuit for an inkjet printhead
US Patent 9132656 Consumable supply item with fluid sensing and pump enable for micro-fluid applications
US Patent 9137093 Analyzing requests for data made by users that subscribe to a provider of network connectivity
US Patent 9176921 Dynamic address change optimizations
US Patent 9194734 Liquid level sensor system
US Patent 9213396 Methods and apparatus for setting the address of a module using a clock
US Patent 9213927 Methods for setting the address of a module
US Patent 9254661 Liquid ejecting head manufacturing method and liquid ejecting head
US Patent 9298908 Methods and apparatus for setting the address of a module using a voltage
•••
Patent Inventor Names
David Olsen
Anthony Donald Studer
Brian Allen Nichols
Quinton Buford Weaver
Patent Jurisdiction
United States Patent and Trademark Office
Patent Number
11787194
Patent Primary Examiner
Matthew Luu
CPC Code
B41J 2/17553
B41J 2/17556
B41J 2/17559
B41J 2/17566
B41J 29/393
B41J 2002/17516
B41J 2002/17579
B41J 2002/17586
B41J 2202/13
B41J 2202/20
•••
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