Patent 11776872 was granted and assigned to Arris on October, 2023 by the United States Patent and Trademark Office.
A heat sink includes a first flange, a second flange, and an accordion-shaped medial portion continuous between the first flange and the second flange. The first flange and the second flange are configured to be attached to a circuit board. The accordion-shaped medial portion includes troughs on a proximal side of the accordion-shaped medial portion and crests on a distal side of the accordion-shaped medial portion such that the heat sink is configured to disperse heat away from the circuit board.