Is a
Patent attributes
Patent Jurisdiction
Patent Number
Patent Inventor Names
Hiroki Okada
Date of Patent
September 26, 2023
Patent Application Number
17224615
Date Filed
April 7, 2021
Patent Citations
Patent Primary Examiner
Patent abstract
A printed circuit board includes a rigid region and a flexible region; a first substrate disposed on the rigid region and the flexible region and comprising a first insulating layer and a first wiring layer comprising a first groove in the flexible region; and a second substrate disposed on the first substrate in the rigid region and comprising a first adhesive layer, a second insulating layer and a second wiring layer.
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