Is a
Patent attributes
Patent Applicant
Current Assignee
Patent Jurisdiction
Patent Number
Patent Inventor Names
Yen-Jen Chen
Tzu-Jin Yeh
Hsieh-Hung Hsieh
Date of Patent
September 26, 2023
Patent Application Number
18151959
Date Filed
January 9, 2023
Patent Citations
Patent Primary Examiner
Patent abstract
An IC includes a plurality of pads at a top surface of a semiconductor wafer, an amplifier configured to receive a first AC signal at an input terminal, and output a second AC signal at an output terminal, a first detection circuit coupled to the input terminal and configured to output a first DC voltage to a first pad of the plurality of pads responsive to the first AC signal, and a second detection circuit coupled to the output terminal and configured to output a second DC voltage to a second pad of the plurality of pads responsive to the second AC signal.
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