Patent attributes
A vapor chamber structure includes a main body formed of a metal plate and a ceramic plate. The metal plate and the ceramic plate are closed to each other to define a chamber therebetween; and the chamber is internally provided with a wick structure, a support structure, and a working fluid. The metal plate and the ceramic plate are connected to each other via welding or a direct bonding copper process, and the support structure is connected to between the metal plate and the ceramic plate also via welding or the direct bonding copper process. By contacting the ceramic plate of the vapor chamber with a heat source packaged in a ceramic material to transfer heat, the problem of crack at an interface between the vapor chamber and the heat source due to thermal fatigue can be overcome.
