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US Patent 11764198 Method and device for bonding of chips

Overview Structured Data Issues Contributors Activity

Is a

Date Filed

March 2, 2017

Date of Patent

September 19, 2023

Patent Application Number

16483077

Patent Citations

US Patent 10438921 Method for direct bonding with self-alignment using ultrasound

US Patent 10497589 Method and device for severing a microchip from a wafer and arranging the microchip on a substrate

US Patent 7714336 LED device and method by which it is produced

US Patent 8042593 Semiconductor chip bonding apparatus

US Patent 8330245 Semiconductor wafers with reduced roll-off and bonded and unbonded SOI structures produced from same

US Patent 8440541 Methods for reducing the width of the unbonded region in SOI structures

US Patent 8461017 Methods of forming bonded semiconductor structures using a temporary carrier having a weakened ion implant region for subsequent separation along the weakened region

US Patent 8575002 Direct bonding method with reduction in overlay misalignment

US Patent 8642444 Method of manufacturing bonded substrate, bonded substrate, method of manufacturing solid-state imaging apparatus, solid-state imaging apparatus, and camera

US Patent 9040385 Mechanisms for cleaning substrate surface for hybrid bonding

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Patent Inventor Names

Markus Wimplinger

Patent Jurisdiction

United States Patent and Trademark Office

Patent Number

Patent Primary Examiner

CPC Code

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