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US Patent 11760059 Method of room temperature covalent bonding

OverviewStructured DataIssuesContributorsActivity
Is a
Patent
Patent
Date Filed
July 24, 2019
Date of Patent
September 19, 2023
Patent Application Number
16521493
Patent Citations
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US Patent 9299736 Hybrid bonding with uniform pattern density
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US Patent 9620481 Substrate bonding with diffusion barrier structures
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US Patent 9656852 CMOS-MEMS device structure, bonding mesa structure and associated method
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US Patent 9723716 Contact pad structure, an electronic component, and a method for manufacturing a contact pad structure
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US Patent 9728521 Hybrid bond using a copper alloy for yield improvement
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US Patent 9741620 Structures and methods for reliable packages
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US Patent 9799587 Semiconductor device
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US Patent 9852988 Increased contact alignment tolerance for direct bonding
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US Patent 9881882 Semiconductor package with three-dimensional antenna
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US Patent 9893004 Semiconductor interposer integration
•••
Patent Inventor Names
Qin-Yi Tong
Patent Jurisdiction
United States Patent and Trademark Office
United States Patent and Trademark Office
Patent Number
11760059
Patent Primary Examiner
‌
Philip C. Tucker
CPC Code
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H01L 2224/80895
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H01L 2924/05442
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H01L 2924/3512
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H01L 21/3105
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H01L 21/76251
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H01L 2224/0401
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H01L 2224/08059
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H01L 2224/81894
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H01L 2224/8319
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H01L 2224/8385
•••

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