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US Patent 11756969 Germanium-silicon light sensing apparatus

Patent 11756969 was granted and assigned to Artilux on September, 2023 by the United States Patent and Trademark Office.

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Is a
Patent
Patent

Patent attributes

Patent Applicant
Artilux
Artilux
Current Assignee
Artilux
Artilux
Patent Jurisdiction
United States Patent and Trademark Office
United States Patent and Trademark Office
Patent Number
11756969
Patent Inventor Names
Han-Din Liu
Szu-Lin Cheng
Hui-Wen Chen
Yun-Chung Na
Shu-Lu Chen
Che-Fu Liang
Date of Patent
September 12, 2023
Patent Application Number
16929861
Date Filed
July 15, 2020
Patent Citations
‌
US Patent 7629661 Semiconductor devices with photoresponsive components and metal silicide light blocking structures
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US Patent 7750958 Pixel structure
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US Patent 7826058 All optical and hybrid reflection switch at a semiconductor/glass interface due to laser beam intersection
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US Patent 7884310 Device and method for the demodulation electromagnetic wave fields having separated detection and demodulation regions
‌
US Patent 7888763 Backside illuminated imaging sensor with improved infrared sensitivity
‌
US Patent 7961301 Flash LADAR system
‌
US Patent 7972885 Broadband imaging device and manufacturing thereof
‌
US Patent 8129813 Optoelectronic sensor and device for 3D distance measurement
...
Patent Primary Examiner
‌
Brigitte A Paterson
CPC Code
‌
H01L 31/02327
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H01L 27/14605
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H01L 27/14621
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H01L 27/14627
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H01L 27/1463
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H01L 27/14632
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H01L 27/14634
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H01L 27/14636
...

A method for fabricating an image sensor array having a first group of photodiodes for detecting light at visible wavelengths a second group of photodiodes for detecting light at infrared or near-infrared wavelengths, the method including growing a germanium-silicon layer on a semiconductor donor wafer; defining pixels of the image sensor array on the germanium-silicon layer; defining a first interconnect layer on the germanium-silicon layer, wherein the interconnect layer includes a plurality of interconnects coupled to the first group of photodiodes and the second group of photodiodes; defining integrated circuitry for controlling the pixels of the image sensor array on a semiconductor carrier wafer; defining a second interconnect layer on the semiconductor carrier wafer, wherein the second interconnect layer includes a plurality of interconnects coupled to the integrated circuitry; and bonding the first interconnect layer with the second interconnect layer.

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