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US Patent 11745424 Building material enclosure comprising a thermal break

Patent 11745424 was granted and assigned to Formlabs on September, 2023 by the United States Patent and Trademark Office.

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Is a
Patent
Patent

Patent attributes

Patent Applicant
Formlabs
Formlabs
Current Assignee
Formlabs
Formlabs
Patent Jurisdiction
United States Patent and Trademark Office
United States Patent and Trademark Office
Patent Number
11745424
Patent Inventor Names
Christopher Auld
Luke Plummer
Robb Morgan
Date of Patent
September 5, 2023
Patent Application Number
17022401
Date Filed
September 16, 2020
Patent Citations
‌
US Patent 10363603 Method for producing a component and an apparatus for working the method
Patent Citations Received
Loading...
1
Patent Primary Examiner
‌
Leith S Shafi
CPC Code
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B29C 64/25
‌
B22F 12/38
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B29C 64/153
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B29C 64/295
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B29C 64/255

According to some aspects, degradation of material in a sintering additive fabrication process may be mitigated or avoided by fabricating parts within a chamber that includes one or more thermal breaks. The thermal break may be implemented using a variety of structures, but generally allows material in the chamber close to the surface to be maintained at different temperatures than the material further from the surface. For instance, as a result of the thermal break, parts located within the material of the chamber that were formed earlier during fabrication may be kept cooler to avoid damage to the parts yet the upper surface (sometimes called the “build surface”) of unconsolidated material may be heated enough so as to require minimal additional energy exposure to trigger consolidation.

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