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US Patent 11701819 Additive manufacturing, spatial heat treating system and method

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Is a
Patent
Patent
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Patent attributes

Current Assignee
Seurat Technologies
Seurat Technologies
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Patent Jurisdiction
United States Patent and Trademark Office
United States Patent and Trademark Office
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Patent Number
117018190
Date of Patent
July 18, 2023
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Patent Application Number
154194490
Date Filed
January 30, 2017
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Patent Citations
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US Patent 8199787 Laser diode package with enhanced cooling
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US Patent 9283593 Selective laser melting / sintering using powdered flux
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US Patent 9308583 System and method for high power diode based additive manufacturing
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US Patent 9331452 Method and system for homogenizing diode laser pump arrays
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US Patent 9522426 Systems and methods for additive manufacturing and repair of metal components
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US Patent 9573193 Apparatuses, systems and methods for three-dimensional printing
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US Patent 9815139 Method for processing a part with an energy beam
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US Patent 9855625 System and method for high power diode based additive manufacturing
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Patent Primary Examiner
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Kevin E Yoon
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CPC Code
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B22F 3/1039
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B22F 2999/00
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C21D 11/005
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C21D 1/84
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B28B 1/001
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B29C 64/277
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B28B 17/0081
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B23K 26/342
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An additive manufacturing system including a two-dimensional energy patterning system for imaging a powder bed is disclosed. The two-dimensional energy patterning system may be used to control the rate of cooling experienced by each successive additive layer. Accordingly, the system may be used to heat treat the various additive layers.

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