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US Patent 11697587 Bone-conduction sensor assembly
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Patent
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Date Filed
December 3, 2021
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Date of Patent
July 11, 2023
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Patent Application Number
17541290
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Patent Citations
US Patent 9661411 Integrated MEMS microphone and vibration sensor
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US Patent 11297406 Acoustic transducers with a low pressure zone and diaphragms having a pressure sensor
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Patent Jurisdiction
United States Patent and Trademark Office
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Patent Number
11697587
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Patent Primary Examiner
David J Bolduc
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CPC Code
B81B 7/02
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B81B 3/0027
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B81B 2201/0285
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H04R 25/606
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