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US Patent 11691871 Microelectromechanical system (MEMS) vibration sensor having a segmented backplate

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Patent
Patent
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Patent Applicant
Infineon Technologies
Infineon Technologies
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Current Assignee
Infineon Technologies
Infineon Technologies
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Patent Jurisdiction
United States Patent and Trademark Office
United States Patent and Trademark Office
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Patent Number
116918710
Date of Patent
July 4, 2023
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Patent Application Number
173518650
Date Filed
June 18, 2021
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Patent Citations
‌
US Patent 9661411 Integrated MEMS microphone and vibration sensor
0
Patent Primary Examiner
‌
Walter F Briney, III
0

A MEMS vibration sensor includes a membrane having an inertial mass, the membrane being affixed to a holder of the MEMS vibration sensor; and a segmented backplate spaced apart from the membrane, the segmented backplate being affixed to the holder.

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