US Patent 11688677 Continuous interconnects between heterogeneous materials
Patent 11688677 was granted and assigned to Liquid Wire Inc. on June, 2023 by the United States Patent and Trademark Office.
Is a
Current Assignee
Date Filed
May 18, 2021
0
Date of Patent
June 27, 2023
0
Patent Applicant
Patent Application Number
17303030
0
Patent Citations Received
Patent Jurisdiction
Patent Number
Patent Primary Examiner
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