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US Patent 11685014 Formulations for advanced polishing pads

OverviewStructured DataIssuesContributorsActivity
Is a
Patent
Patent
0
Current Assignee
Applied Materials
Applied Materials
0
Date Filed
August 2, 2019
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Date of Patent
June 27, 2023
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Patent Applicant
Applied Materials
Applied Materials
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Patent Application Number
16529884
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Patent Citations
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US Patent 7186322 Methods of producing and polishing semiconductor device and polishing apparatus
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US Patent 7195544 CMP porous pad with component-filled pores
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US Patent 7204742 Polishing pad comprising hydrophobic region and endpoint detection port
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US Patent 7252871 Polishing pad having a pressure relief channel
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US Patent 7264641 Polishing pad comprising biodegradable polymer
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US Patent 7267607 Transparent microporous materials for CMP
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US Patent 7267610 CMP pad having unevenly spaced grooves
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US Patent 7300340 CMP pad having overlaid constant area spiral grooves
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US Patent 7300619 Compositions and methods for use in three dimensional model printing
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US Patent 7311862 Method for manufacturing microporous CMP materials having controlled pore size
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•••
Patent Jurisdiction
United States Patent and Trademark Office
United States Patent and Trademark Office
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Patent Number
11685014
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Patent Primary Examiner
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Larry W Thrower
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CPC Code
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B29L 2031/736
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C08F 283/008
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B29C 64/112
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B24B 37/24
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B33Y 10/00
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B33Y 70/00
0
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B33Y 80/00
0

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