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US Patent 11682606 Semiconductor with integrated electrically conductive cooling channels
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Is a
Patent
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Date Filed
February 7, 2019
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Date of Patent
June 20, 2023
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Patent Application Number
16269702
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Patent Citations
US Patent 8872328 Integrated power module package
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US Patent 7763970 Power module
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US Patent 7884468 Cooling systems for power semiconductor devices
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Patent Jurisdiction
United States Patent and Trademark Office
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Patent Number
11682606
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Patent Primary Examiner
Sheikh Maruf
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CPC Code
H01L 23/49
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H01L 24/48
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H01L 2224/48175
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H01L 2224/48245
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H01L 2224/4918
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H01L 23/473
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H01L 2924/00014
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H01L 23/367
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H01L 25/072
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H01L 23/46
0
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