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US Patent 11677373 Impedence matching conductive structure for high efficiency RF circuits

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Patent
Patent
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Patent attributes

Patent Applicant
3D Glass Solutions, Inc.
3D Glass Solutions, Inc.
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Current Assignee
3D Glass Solutions, Inc.
3D Glass Solutions, Inc.
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Patent Jurisdiction
United States Patent and Trademark Office
United States Patent and Trademark Office
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Patent Number
116773730
Date of Patent
June 13, 2023
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Patent Application Number
167670960
Date Filed
December 31, 2018
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US Patent 8076162 Method of providing particles having biological-binding areas for biological applications
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US Patent 8096147 Methods to fabricate a photoactive substrate suitable for shaped glass structures
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US Patent 8709702 Methods to fabricate a photoactive substrate suitable for microfabrication
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US Patent 9385083 Wafer-level die to package and die to die interconnects suspended over integrated heat sinks
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...
Patent Primary Examiner
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Binh X Tran
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CPC Code
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C03C 15/00
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C03C 2218/34
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H05K 3/0017
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H05K 3/107
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The present invention includes a method of making a RF impedance matching device in a photo definable glass ceramic substrate. A ground plane may be used to adjacent to or below the RF Transmission Line in order to prevent parasitic electronic signals, RF signals, differential voltage build up and floating grounds from disrupting and degrading the performance of isolated electronic devices by the fabrication of electrical isolation and ground plane structures on a photo-definable glass substrate.

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