Is a
Patent attributes
Patent Applicant
Current Assignee
Patent Jurisdiction
Patent Number
Date of Patent
June 6, 2023
0Patent Application Number
170734150
Date Filed
October 19, 2020
0Patent Citations
...
Patent Primary Examiner
CPC Code
Provided is a die stack structure including a first die and a second die. The first die and the second die are bonded together through a hybrid bonding structure. A bonding insulating layer of the hybrid bonding structure extends to contact with one interconnect structure of the first die or the second die.
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