Is a
Patent attributes
Patent Applicant
Current Assignee
Patent Jurisdiction
Patent Number
Date of Patent
June 6, 2023
0Patent Application Number
160912900
Date Filed
April 13, 2017
0Patent Citations
Patent Primary Examiner
A method of forming a medical device lead connection element is described. The method includes positioning an end portion of a lead filar to overlap a lead end connection element such that the positioning creates mutual interference between the lead filar and the lead end connection element, and forming an interference configuration. Then melting the end portion of the lead filar to form a weld joint and allowint the end portion of the lead filar to move towards the end connection element.
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