Patent attributes
A method of manufacturing a display apparatus including the steps of providing a plurality of light emitting diode chips on a first manufacturing substrate, placing a transferring plate above the light emitting diode chips, bonding a plurality of adhesive transferring portions disposed on the transferring plate to a portion of the light emitting diode chips disposed on the first manufacturing substrate, separating the portion of the light emitting diode chips from the first manufacturing substrate, coupling the portion of the light emitting diode chips disposed on the transferring plate to a plurality of first and second substrate electrodes disposed on a substrate, and separating the transferring plate from the portion of the light emitting diode chips coupled to the substrate, in which the adhesive transferring portions are regularly arranged in rows and columns on the transferring plate.
