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US Patent 11652082 Particle capture using transfer stamp
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Is a
Patent
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Date Filed
July 1, 2020
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Date of Patent
May 16, 2023
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Patent Application Number
16918995
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Patent Citations
US Patent 10468363 Chiplets with connection posts
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US Patent 10438859 Transfer printed device repair
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US Patent 10899067 Multi-layer stamp
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US Patent 9217541 Stabilization structure including shear release posts
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US Patent 10262966 Methods for surface attachment of flipped active components
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Patent Citations Received
US Patent 12094851 Particle capture using transfer stamp
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Patent Inventor Names
Ronald S. Cok
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Patent Jurisdiction
United States Patent and Trademark Office
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Patent Number
11652082
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Patent Primary Examiner
Vu A Vu
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CPC Code
H01L 2221/68368
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H01L 21/67144
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H01L 2224/75303
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B41F 16/0046
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H01L 21/67092
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H01L 21/6835
0
H01L 24/83
0
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