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US Patent 11650384 Thermal optimizations for OSFP optical transceiver modules

Patent 11650384 was granted and assigned to Google on May, 2023 by the United States Patent and Trademark Office.

Overview Structured Data Issues Contributors

Is a

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Patent attributes

Patent Applicant

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Current Assignee

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Patent Jurisdiction

United States Patent and Trademark Office

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Patent Number

Patent Inventor Names

Justin Sishung Lee1

Melanie Beauchemin1

Michael Chi Kin Lau1

Timothy Conrad Lee1

William F. Edwards, Jr.1

Zuowei Shen1

Federico Pio Centola1

Madhusudan K. Iyengar1

Date of Patent

May 16, 2023

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Patent Application Number

176680621

Date Filed

February 9, 2022

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Patent Citations

US Patent 10368464 Thermal solution for transceiver module

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US Patent 10069248 Connector housing with heat dissipation structure

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US Patent 10104760 Pluggable module having cooling channel with heat transfer fins

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US Patent 10128627 Cable adapter

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US Patent 10409340 Electronic device

1

US Patent 10455739 High-frequency connecting device with enhanced cooling efficiency of optical module

1

US Patent 10477729 Receptacle assembly and thermal-transfer assembly

1

US Patent 10511118 Recepticle assembly with thermal management

1

...

Patent Citations Received

US Patent 12066653 Communication systems having optical power supplies

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US Patent 11997819 Data processing systems including optical communication modules

3

US Patent 12004318 Data processing systems including optical communication modules

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US Patent 12019289 Communication systems having pluggable modules

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US Patent 12029004 Data processing systems including optical communication modules

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Patent Primary Examiner

1

Heat dissipation and electric shielding techniques and apparatuses are disclosed to enable the operation of OSFP modules at higher bandwidths. OSFP compatible techniques are discussed including the use of water cooling, addition of heat pipes, use of intercoolers, air-fins and air-foils, optimization of cooling fins, use of vapor chambers are discussed.

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