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US Patent 11647607 Localized immersion cooling enclosure with thermal efficiency features

OverviewStructured DataIssuesContributorsActivity
Is a
Patent
Patent
0
Date Filed
January 22, 2021
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Date of Patent
May 9, 2023
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Patent Application Number
17156085
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Patent Citations
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US Patent 10194559 Electronic apparatus and cooling system for electronic apparatus
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US Patent 10249983 Connector with integrated heat sink
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US Patent 10321609 Cooling system and method of cooling electronic device
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US Patent 10438867 Immersion cooling temperature control method, system, and apparatus
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US Patent 10542640 Liquid chamber housings
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US Patent 10827649 Cooling fluids in opposite directions across a device
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US Patent 10617035 Additively manufactured structures for gradient thermal conductivity
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US Patent 11112189 Cold plate and manufacturing method of cold plate
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US Patent 10104760 Pluggable module having cooling channel with heat transfer fins
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US Patent 10178804 Heat spreader for an electrical connector assembly
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Patent Jurisdiction
United States Patent and Trademark Office
United States Patent and Trademark Office
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Patent Number
11647607
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Patent Primary Examiner
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Zachary Pape
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CPC Code
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H05K 1/0203
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H05K 7/20236
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H05K 7/20636
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H05K 7/20772
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