Patent attributes
An earphone module, including a housing, a circuit board, a feeding conductor, a first grounding conductor, and a second grounding conductor, is provided. The housing includes an insulating housing and a metal ring connected thereto. The metal ring serves as an antenna and includes a feeding end, a first ground end, a second ground end, and a slit that splits the metal ring. The slit is located between the feeding end and the first ground end. The second ground end is located between the feeding end and the slit. The circuit board is located in the insulating housing. A slot is formed between the circuit board and the metal ring. The feeding conductor is connected to the feeding end and the circuit board. The first grounding conductor is connected to the first ground end and the circuit board. The second grounding conductor is connected to the second ground end and the circuit board.
