US Patent 11631634 Leadless semiconductor package and method of manufacture
Patent 11631634 was granted and assigned to Nexperia on April, 2023 by the United States Patent and Trademark Office.
Is a
Current Assignee
Date Filed
March 3, 2021
0
Date of Patent
April 18, 2023
0
Patent Applicant
Patent Application Number
17190508
0
Patent Inventor Names
Ringo Cheung
0
On Lok Chau
0
Fei Wong
0
Billie Bi
0
Patent Jurisdiction
Patent Number
Patent Primary Examiner
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