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US Patent 11627654 Electronic device including heat dissipation structure
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Is a
Patent
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Date Filed
August 21, 2020
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Date of Patent
April 11, 2023
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Patent Application Number
16999487
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Patent Citations Received
US Patent 12078691 Housing assembly for accommodating printed circuit boards
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Patent Inventor Names
Chunghyo Jung
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Patent Jurisdiction
United States Patent and Trademark Office
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Patent Number
11627654
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Patent Primary Examiner
Timothy J Thompson
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CPC Code
H01L 23/3735
0
H01L 23/3736
0
H01L 23/42
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H01L 23/552
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H04M 1/0202
0
H04M 1/026
0
H05K 1/0203
0
H05K 1/0216
0
G06F 1/1656
0
H05K 1/02
0
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