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US Patent 11621387 Quantum device with low surface losses

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Is a
Patent
Patent
0

Patent attributes

Patent Jurisdiction
United States Patent and Trademark Office
United States Patent and Trademark Office
0
Patent Number
116213870
Patent Inventor Names
Harry Jonathon Mamin0
Yves Martin0
Martin O. Sandberg0
Jason S. Orcutt0
Antoine Hervier0
Date of Patent
April 4, 2023
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Patent Application Number
171986660
Date Filed
March 11, 2021
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Patent Citations
‌
US Patent 10546992 Buried electrode geometry for lowering surface losses in superconducting microwave circuits
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US Patent 10693566 Wireless Josephson parametric converter
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US Patent 10665769 Quantum circuit assemblies with vertically-stacked parallel-plate capacitors
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US Patent 10748961 Interconnects below qubit plane by substrate bonding
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US Patent 10256392 Vertical transmon qubit device
0
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US Patent 10304005 Modular array of vertically integrated superconducting qubit devices for scalable quantum computing
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Patent Primary Examiner
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Shahed Ahmed
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CPC Code
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G06N 10/00
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H01L 21/76891
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H01L 39/24
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H01L 39/025
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H01L 29/66977
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H01L 27/18
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G06N 10/40
0

Circuits and methods of operation that can facilitate reducing surface losses for quantum devices are provided. In one example, a quantum device can comprise a dielectric layer, a first electrode, and a second electrode. The dielectric layer can comprise a recess formed in a surface of the dielectric layer that reduces a thickness of the dielectric layer from a first thickness external to a footprint of the recess to a second thickness within the footprint of the recess. The second thickness can be less than the first thickness. The first electrode can be positioned within the footprint of the recess. The second electrode can be electrically isolated from the first electrode by the dielectric layer. The first and second electrodes can be positioned on opposing surfaces of the dielectric layer.

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