US Patent 11621244 Integrated circuit package and method
Patent 11621244 was granted and assigned to Taiwan Semiconductor Manufacturing Company on April, 2023 by the United States Patent and Trademark Office.
Is a
Current Assignee
Date Filed
November 15, 2019
0
Date of Patent
April 4, 2023
0
Patent Applicant
Patent Application Number
16684913
0
Patent Inventor Names
Wei Ling Chang
0
Chen-Hua Yu
0
Chieh-Yen Chen
0
Chuei-Tang Wang
0
Patent Jurisdiction
Patent Number
Patent Primary Examiner
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