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US Patent 11612049 Modified split structure particle accelerators

Patent 11612049 was granted and assigned to Radiabeam Technologies, LLC on March, 2023 by the United States Patent and Trademark Office.

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Is a
Patent
Patent
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Patent attributes

Patent Applicant
Radiabeam Technologies, LLC
Radiabeam Technologies, LLC
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Current Assignee
Radiabeam Technologies, LLC
Radiabeam Technologies, LLC
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Patent Jurisdiction
United States Patent and Trademark Office
United States Patent and Trademark Office
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Patent Number
116120490
Patent Inventor Names
Ronald Agustsson0
Sergey Kutsaev0
Salime Boucher0
Date of Patent
March 21, 2023
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Patent Application Number
172764460
Date Filed
September 18, 2019
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Patent Citations
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US Patent 10263170 Bumped resonator structure
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US Patent 10212800 Compact linear accelerator with accelerating waveguide
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US Patent 10609809 Compact linear accelerator with accelerating waveguide
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US Patent 10880985 Compact linear accelerator with accelerating waveguide
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US Patent 10932354 Split structure particle accelerators
Patent Citations Received
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US Patent 11950352 Split structure particle accelerators
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US Patent 12137514 Linear accelerator for generating high X-ray doses
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Patent Primary Examiner
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Minh D A
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CPC Code
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H05H 9/00
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A61N 5/10
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A61N 2005/1087
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H05H 7/20
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H05H 9/044
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H05H 2007/225
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H05H 7/22
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H05H 7/18
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...

A particle accelerator can include a first waveguide portion and a second waveguide portion. The first waveguide portion can include a first plurality of cell portions and a first iris portion that is disposed between two of the first plurality of cell portions. The first iris portion can include a first portion of an aperture such that the aperture is configured to be disposed about a beam axis. The first waveguide portion can further include a first bonding surface. The second waveguide portion can include a second plurality of cell portions and a second iris portion that is disposed between two of the second plurality of cell portions. The second iris portion can include a second portion of the aperture. The second waveguide portion can include a second bonding surface.

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