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US Patent 11551125 High density microwave hermetic interconnects for quantum applications

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Is a
Patent
Patent

Patent attributes

Patent Jurisdiction
United States Patent and Trademark Office
United States Patent and Trademark Office
Patent Number
11551125
Date of Patent
January 10, 2023
Patent Application Number
16281657
Date Filed
February 21, 2019
Patent Citations
‌
US Patent 10068181 Microwave integrated quantum circuits with cap wafer and methods for making the same
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US Patent 10565515 Quantum circuit assemblies with triaxial cables
‌
US Patent 10319896 Shielded interconnects
‌
US Patent 10586909 Cryogenic electronic packages and assemblies
‌
US Patent 10043136 Reducing the number of input lines to superconducting quantum processors installed inside dilution refrigerators
‌
US Patent 10049788 Constant impedance connector system for quantum computer applications
Patent Primary Examiner
‌
Dzung D. Tran
CPC Code
‌
G06N 10/00
‌
H01P 3/06
‌
H01P 5/085
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H01L 39/045

A quantum computer includes a refrigeration system under vacuum including a containment vessel, a qubit chip contained within a refrigerated vacuum environment defined by the containment vessel. The quantum computer further includes a plurality of interior electromagnetic waveguides and a plurality of exterior electromagnetic waveguides. The quantum computer further includes a hermetic connector assembly operatively connecting the interior electromagnetic waveguides to the exterior electromagnetic waveguides while maintaining the refrigerated vacuum environment. The hermetic connector assembly includes an exterior multi-waveguide connector, an interior multi-waveguide connector, and a dielectric plate arranged between and hermetically sealed with the exterior multi-waveguide connector and the interior multi-waveguide connector. The dielectric plate permits electromagnetic energy when carried by the interior and exterior pluralities of electromagnetic waveguides to pass therethrough.

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