US Patent 11545423 Package structure and manufacturing method thereof
Patent 11545423 was granted and assigned to Powertech Technology on January, 2023 by the United States Patent and Trademark Office.
Is a
Current Assignee
Date Filed
November 18, 2020
0
Date of Patent
January 3, 2023
0
Patent Applicant
Patent Application Number
16952044
0
Patent Inventor Names
Shang-Yu Chang Chien
0
Hung-Hsin Hsu
0
Nan-Chun Lin
0
Patent Jurisdiction
Patent Number
Patent Primary Examiner
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