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US Patent 11532617 Semiconductor structure and method of forming the same

Patent 11532617 was granted and assigned to MediaTek on December, 2022 by the United States Patent and Trademark Office.

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Contents

Is a
Patent
Patent
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Patent attributes

Patent Applicant
MediaTek
MediaTek
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Current Assignee
MediaTek
MediaTek
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Patent Jurisdiction
United States Patent and Trademark Office
United States Patent and Trademark Office
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Patent Number
115326170
Patent Inventor Names
Po-Chao Tsao0
Date of Patent
December 20, 2022
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Patent Application Number
171346940
Date Filed
December 28, 2020
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Patent Citations
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US Patent 10038054 Variable gate width for gate all-around transistors
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US Patent 11069818 Semiconductor device
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Patent Citations Received
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US Patent 11978734 Semiconductor structure and method of forming the same
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US Patent 11942548 Multi-gate device and method of fabrication thereof
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Patent Primary Examiner
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Tong-Ho Kim
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CPC Code
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H01L 29/66545
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H01L 29/66787
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H01L 29/78618
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H01L 29/78681
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H01L 29/78684
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H01L 29/78696
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H01L 21/823412
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H01L 29/66439
0
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A semiconductor structure includes the first semiconductor stack and the second semiconductor stack formed over the first region and the second region of a substrate, respectively. The first and second semiconductor stacks extend in the first direction and are spaced apart from each other in the second direction. Each of the first semiconductor stack and the second semiconductor stack includes channel layers and a gate structure. The channel layers are formed above the substrate and are spaced apart from each other in the third direction. The gate structure includes the gate dielectric layers formed around the respective channel layers, and the gate electrode layer formed on the gate dielectric layers to surround the channel layers. The number of channel layers in the first semiconductor stack is different from the number of channel layers in the second semiconductor stack.

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