Patent 11527819 was granted and assigned to Skyworks Solutions, Inc. on December, 2022 by the United States Patent and Trademark Office.
A printed circuit board can include a substrate layer, a first metal layer disposed over the substrate layer, a core layer disposed over the first metal layer, and a second metal layer disposed over the core layer, where the core layer defines a closed cavity between the first and second metal layers. Optionally, the cavity is filled with air and operates as an antenna.