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US Patent 11527419 Photonic integrated package and method forming same

OverviewStructured DataIssuesContributors
Is a
Patent
Patent
Current Assignee
Taiwan Semiconductor Manufacturing Company
Taiwan Semiconductor Manufacturing Company
Date Filed
September 14, 2020
Date of Patent
December 13, 2022
Patent Application Number
17020245
Patent Citations
‌
US Patent 10527790 Passive fiber coupler with UV windows
‌
US Patent 10388608 Semiconductor device and method for manufacturing same
‌
US Patent 10510674 Fan-out package having a main die and a dummy die, and method of forming
‌
US Patent 10162139 Semicondcutor package
Patent Jurisdiction
United States Patent and Trademark Office
United States Patent and Trademark Office
Patent Number
11527419
Patent Primary Examiner
‌
Nikolay K Yushin
CPC Code
‌
H01L 21/28167
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H01L 21/823807
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H01L 21/823857
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H01L 23/3121
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H01L 23/3171
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H01L 23/5226
‌
H01L 23/5283
‌
H01L 23/5383
‌
H01L 23/5386
‌
H01L 24/09
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