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US Patent 11524458 Laser pulse shaping for additive manufacturing

Patent 11524458 was granted and assigned to Lawrence Livermore National Security (company) on December, 2022 by the United States Patent and Trademark Office.

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Contents

Is a
Patent
Patent
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Patent attributes

Patent Applicant
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Lawrence Livermore National Security (company)
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Current Assignee
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Lawrence Livermore National Security (company)
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Patent Jurisdiction
United States Patent and Trademark Office
United States Patent and Trademark Office
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Patent Number
115244580
Patent Inventor Names
James A. DeMuth0
Christopher M. Spadaccini0
Andrew J. Bayramian0
Eric B. Duoss0
Joshua D. Kuntz0
Date of Patent
December 13, 2022
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Patent Application Number
165381520
Date Filed
August 12, 2019
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Patent Citations
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US Patent 10220471 Spatter reduction laser scanning strategy in selective laser melting
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US Patent 10376987 Laser pulse shaping for additive manufacturing
Patent Citations Received
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US Patent 11772164 Powder bed recoater
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US Patent 11872754 Recoater using alternating current to planarize top surface of powder bed
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Patent Primary Examiner
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Dana Ross
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CPC Code
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B33Y 30/00
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B33Y 50/02
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B22F 10/10
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B22F 10/20
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B22F 12/00
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Y02P 10/25
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B29C 64/20
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B29C 64/282
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The present disclosure relates to an apparatus for additively manufacturing a product in a layer-by-layer sequence, wherein the product is formed using powder particles deposited on an interface layer of a substrate. A laser generates first and second beam components. The second beam component has a higher power level and a shorter duration than the first beam component. A mask creates a 2D optical pattern in which only select portions of the second beam components can irradiate the powder particles. The first beam component heats the powder particles close to a melting point, where the particles experience surface tension forces relative to the interface layer. While the particles are heated, the second beam component further heats the particles and also melts the interface layer before the surface tension forces can act on and distort the particles, enabling the particles and the interface layer are able to bond together.

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