US Patent 11515324 3D NAND structures with decreased pitch
Patent 11515324 was granted and assigned to Applied Materials on November, 2022 by the United States Patent and Trademark Office.
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Patent Inventor Names
Thomas Kwon0
Xinhai Han0
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Edits on 30 Nov, 2022
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US Patent 11515324 3D NAND structures with decreased pitch
Article
Methods of forming 3D NAND devices are discussed. Some embodiments form 3D NAND devices with increased cell density. Some embodiments form 3D NAND devices with decreased vertical and/or later pitch between cells. Some embodiments form 3D NAND devices with smaller CD memory holes. Some embodiments form 3D NAND devices with silicon layer between alternating oxide and nitride materials.
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Patent Applicant
Current Assignee
Patent Jurisdiction
Patent Number
115153240
Date of Patent
November 29, 2022
0Patent Application Number
167206430
Date Filed
December 19, 2019
0Patent Citations
Patent Primary Examiner
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