Log in
Sign up
Golden has been acquired by ComplyAdvantage.Read about it here ⟶
‌

US Patent 11515228 Double sided semiconductor package

Patent 11515228 was granted and assigned to Infineon Technologies on November, 2022 by the United States Patent and Trademark Office.

OverviewStructured DataIssuesContributorsActivity
Is a
Patent
Patent
0
Current Assignee
Infineon Technologies
Infineon Technologies
0
Date Filed
January 13, 2021
0
Date of Patent
November 29, 2022
0
Patent Applicant
Infineon Technologies
Infineon Technologies
0
Patent Application Number
17147717
0
Patent Citations
‌
US Patent 11004764 Semiconductor package having symmetrically arranged power terminals and method for producing the same
0
‌
US Patent 10002821 Semiconductor chip package comprising semiconductor chip and leadframe disposed between two substrates
‌
US Patent 10128165 Package with vertically spaced partially encapsulated contact structures
‌
US Patent 10348214 Power module, power converter device, and electrically powered vehicle
‌
US Patent 11018072 Semiconductor package having overlapping electrically conductive regions and method for producing the same
Patent Inventor Names
Tobias Kist
0
Juergen Hoegerl
0
Ordwin Haase
0
Patent Jurisdiction
United States Patent and Trademark Office
United States Patent and Trademark Office
0
Patent Number
11515228
0
CPC Code
‌
H01L 23/49568
0
‌
H01L 23/3672
0

Find more entities like US Patent 11515228 Double sided semiconductor package

Use the Golden Query Tool to find similar entities by any field in the Knowledge Graph, including industry, location, and more.
Open Query Tool
Access by API
Golden Query Tool
Golden logo
By using this site, you agree to our Terms of Service.