Is a
Patent attributes
Patent Applicant
Current Assignee
Patent Jurisdiction
Patent Number
Patent Inventor Names
Alfred A. Zinn0
Date of Patent
November 15, 2022
0Patent Application Number
168028990
Date Filed
February 27, 2020
0Patent Primary Examiner
Vias may be established in printed circuit boards or similar structures and filled with a monolithic metal body to promote heat transfer. Metal nanoparticle paste compositions may provide a ready avenue for filling the vias and consolidating the metal nanoparticles under mild conditions to form each monolithic metal body. The monolithic metal body within each via can be placed in thermal contact with one or more heat sinks to promote heat transfer.
Timeline
No Timeline data yet.
Further Resources
No Further Resources data yet.
