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US Patent 11489457 Semiconductor module and power converter using the same

Patent 11489457 was granted and assigned to Denso on November, 2022 by the United States Patent and Trademark Office.

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Is a
Patent
Patent
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Patent attributes

Patent Applicant
Denso
Denso
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Current Assignee
Denso
Denso
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Patent Jurisdiction
United States Patent and Trademark Office
United States Patent and Trademark Office
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Patent Number
114894570
Patent Inventor Names
Shingo Tsuchimochi0
Seita Iwahashi0
Date of Patent
November 1, 2022
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Patent Application Number
167802670
Date Filed
February 3, 2020
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Patent Primary Examiner
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Elias Ullah
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CPC Code
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H01L 27/0635
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H01L 24/06
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H01L 24/29
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H01L 24/32
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H01L 24/33
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H01L 24/48
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H01L 24/73
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H01L 24/83
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A semiconductor module may include a plurality of semiconductor elements; and a first power terminal, a second power terminal and a third power terminal electrically connected to the plurality of semiconductor elements. The plurality of semiconductor elements may include at least one upper arm switching element electrically connected between the first power terminal and the second power terminal; and at least one lower arm switching element electrically connected between the second power terminal and the third power terminal. A number of the at least one upper arm switching element may be different from a number of the at least one lower arm switching element.

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