US Patent 11482471 Thermal management solutions for integrated circuit packages
Patent 11482471 was granted and assigned to Intel on October, 2022 by the United States Patent and Trademark Office.
Is a
Current Assignee
Date Filed
February 27, 2019
0
Date of Patent
October 25, 2022
0
Patent Applicant
Patent Application Number
16287728
0
Patent Inventor Names
Jiwei Sun
0
Chong Zhang
0
Cheng Xu
0
Zhimin Wan
0
Zhenguo Jiang
0
Ying Wang
0
Yikang Deng
0
Kyu-Oh Lee
0
Junnan Zhao
0
Patent Jurisdiction
Patent Number
Patent Primary Examiner
Find more entities like US Patent 11482471 Thermal management solutions for integrated circuit packages
Use the Golden Query Tool to find similar entities by any field in the Knowledge Graph, including industry, location, and more.
By using this site, you agree to our Terms of Service.