US Patent 11476089 Control method and plasma processing apparatus
Patent 11476089 was granted and assigned to Tokyo Electron on October, 2022 by the United States Patent and Trademark Office.
Is a
Current Assignee
Date Filed
September 10, 2020
Date of Patent
October 18, 2022
Patent Applicant
Patent Application Number
17017039
Patent Citations Received
Patent Jurisdiction
Patent Number
Patent Primary Examiner
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